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document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 1 ir receiver modules for 3d synchronization signals TSOP35D25 vishay semiconductors mechanical data pinning: 1 = gnd, 2 = n.c., 3 = v s , 4 = out features ? center frequency at 25 khz to reduce interference with ir remote control signals at 30 khz to 56 khz ? package can be used with ir emitters with wavelength 830 nm as well as standard 940 nm ? very low supply current and stand-by mode ? photo detector and preamplifier in one package ? internal filter for pcm frequency ? supply voltage range: 2.5 v to 5.5 v ? improved immunity against modulated light sources ? insensitive to supply voltage ripple and noise ? taping available for topv iew and sidevi ew assembly ? compliant to rohs directive 2002/95/ec and in accordance to weee 2002/96/ec description the TSOP35D25 is an smd ir receiver module for 3d sychronisation signals. the receiver is designed to operate at a carrier frequency of 25 khz and a wavelength of 830 nm to avoid interference with standard remote control systems at 940 nm and 30 khz to 56 khz. the TSOP35D25 can receive continuously transmitted signal patterns with a minimum burst length of 6 cycles and frame rates up to 200 hz. the circuit provides good suppression of optical noise from cfls, lcd backlight and plasma panels. block diagram application circuit 16797 1 2 3 4 parts table carrier frequency good noise suppression and fast burst rate 25 khz TSOP35D25 30 k v s out demo - gnd pass agc input pin band dulator control circuit 3 4 1; 2 16839 c 1 ir receiver gnd circuit c r 1 + v s gnd transmitter with tsalxxxx v s v o 17170_5 out r 1 and c 1 are recommended for protection against eos. components should be in the range of 33 < r 1 < 1 k , c 1 > 0.1 f. datasheet.in
www.vishay.com document number: 83298 2 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals note (1) stresses beyond those listed und er absolute maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other cond itions beyond those indicated in the operational sections of t his specification is not implied. exposure to absolute ma ximum rating conditions for extended pe riods may affect the device reliability. typical characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - output active low fig. 2 - puls e length and sensitivity in dark ambient absolute maximum ratings (1) parameter test conditi on symbol value unit supply voltage (pin 3) v s - 0.3 to + 6 v supply current (pin 3) i s 3ma output voltage (pin 4) v o - 0.3 to (v s + 0.3) v output current (pin 4) i o 5ma junction temperature t j 100 c storage temperature range t stg - 40 to + 100 c operating temperature range t amb - 30 to + 85 c power consumption t amb 85 c p tot 10 mw electrical and optical characteristics (1) (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit supply current (pin 3) e v = 0, v s = 3.3 v i sd 0.27 0.35 0.45 ma e v = 40 klx, sunlight i sh 0.45 ma supply voltage v s 2.5 5.5 v transmission distance e v = 0, test signal see fig. 1, ir diode tsal6200, i f = 250 ma d45m output voltage low (pin 4) i osl = 0.5 ma, e e = 0.7 mw/m 2 , test signal see fig. 1 v osl 100 mv minimum irradiance pulse width tolerance: t pi - 80 s < t po < t pi + 160 s, test signal see fig. 1 e e min. 0.15 0.35 mw/m 2 maximum irradiance t pi - 80 s < t po < t pi + 160 s, test signal see fig. 1 e e max. 30 w/m 2 directivity angle of half transmission distance ? 1/2 50 deg e e t t pi *) t v o v oh v ol t po 2) t 14337-1 optical test signal (ir diode tsal6200, i f = 0.4 a, n = 6 pulses, f = f o , t = 10 ms) output signal t d 1) 1) 3/f o < t d < 9/f o 2) t pi - 80 s < t po < t pi + 160 s *) t pi 6/f o is recommended for optimal function e e - irradiance (mw/m 2 ) t po - output pulse width (ms) 22020 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0.1 1 10 10 2 10 3 10 4 10 5 input burst length = 950 nm, optical test signal, fig.1 output pulse width datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 3 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors fig. 3 - output function fig. 4 - output pulse diagram fig. 5 - frequency dependence of responsivity fig. 6 - sensitivity in bright ambient fig. 7 - sensitivity vs. supply voltage disturbances fig. 8 - sensitivity vs. electric field disturbances e e t v o v oh v ol t 600 s 600 s t = 60 ms t on t off 94 8134 optical test signal output signal , (see fig. 4) e e - irradiance (mw/m 2 ) t on , t off - output pulse width (ms) 22021 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.1 1 10 100 1000 10 000 = 950 nm, optical test signal, fig. 1 t on t off 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.7 0.9 1.1 1.3 f/f 0 - relative frequency 16925 f = f 0 5 % f(3 db) = f 0 /10 e /e - rel. responsivity e min. e 0 0.5 1 1.5 2 2.5 3 3.5 4 0.01 0.1 1 10 100 e e - ambient dc irradiance (w/m 2 ) e e min. - threshold irradiance (mw/m 2 ) correlation with ambient light sources: 10 w/m 2 = 1.4 klx (std. illum. a, t = 2855 k) 10 w/m 2 = 8.2 klx (daylight, t = 5900 k) wavelength of ambient illumination: = 950 nm 20757 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1 10 100 1000 vs rms - ac voltage on dc supply voltage (mv) 20753 e e min. - threshold irradiance (mw/m 2 ) f = f o f = 20 khz f = 30 khz f = 100 hz f = 10 khz 0 50 100 150 200 250 300 350 400 450 500 0 500 1000 1500 2000 2500 3000 f - emi frequency (mhz) e - max. field strength (v/m) 20747 datasheet.in
www.vishay.com document number: 83298 4 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals fig. 9 - maximum envelope duty cycle vs. burst length fig. 10 - sensitivity vs. ambient temperature fig. 11 - relative spectral sensitivity vs. wavelength fig. 12 - horizontal directivity fig. 13 - sensitivity vs. supply voltage burst length (number of cycles/burst) max. envelope duty cycle 22022 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 1020304050607080 f = 25 khz, e e = 3 mw/m2 constant irradiance variable irradiance 0 0.05 0.1 0.15 0.2 0.25 0.3 - 30 - 10 10 30 50 70 90 t amb - ambient temperature (c) e e min. - threshold irradiance (mw/m 2 ) 20755 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 700 750 800 850 900 950 1000 1050 1100 - wavelength (nm) s( ) rel - relative spectral sensitivity 20431 16801 0.4 0.2 0 0.2 0.4 0.6 0.6 0.9 0 30 10 20 40 50 60 70 80 1.0 0.8 0.7 d rel - relative transmission distance 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 23456 v s - supply voltage (v) e e min. - sensitivity (mw/m 2 ) 20756 3.5 4.5 5.5 2.5 datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 5 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors suitable data format the TSOP35D25 is designed to suppress spurious output pulses due to noise or disturbance signals. data and disturbance signals can be distin guished by the devices according to carrier frequenc y, burst length and envelope duty cycle. the data signal should be close to the band-pass center frequency (e.g. 25 khz) and fulfill the conditions in the table below. when a data signal is applied to the TSOP35D25 in the presence of a disturbance sign al, the sensitivity of the receiver is reduced to insure that no spurious pulses are present at the output. some examples of disturbance signals which are suppressed are ? dc light (e.g. from tungsten bulb or sunlight) ? continuous signals at any frequency ? strongly or weakly modula ted noise from fluorescent lamps with electronic ballasts (see figure 14 or figure 15) fig. 14 - ir signal from fluorescent lamp with low modulation fig. 15 - ir signal from fluorescent lamp with high modulation 0101520 time (ms) 16920 ir signal ir signal from fluorescent lamp with low modulation 5 0101520 time (ms) 16921 ir signal ir signal from fluorescent lamp with high modulation 5 TSOP35D25 minimum burst length 6 cycles/burst after each burst of length a minimum gap time is required of 6 to 24 cycles 6 cycles for bursts greater than a minimum gap time in the data stream is needed of 24 cycles > 4 x burst length maximum rate of short bursts (constant irradiance) 2000 bursts/s maximum rate of short bursts (variable irradi ance) 220 bursts/s datasheet.in
www.vishay.com document number: 83298 6 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals stand-by mode of the TSOP35D25 if an application requires an ultra low average supply current in order to save battery life, the TSOP35D25 can be operated wit h an intermittent supply voltage. a typical application circuit shown in fig. 16. fig. 16 - application circuit for the tsop3with intermi ttent supply voltage to receive a continuous data signal while using the tsop3 with an intermittent supply voltage, the receiver must be activated in advance of the expected data frame as shown in figure 17. fig. 17 - signal timing in power saving mode with continuo us receivin g function in normal operation without using the stand-by feature, the gain level of the TSOP35D25 returns to a default level after the de vice is disconnected from supply voltage and reconnected again. a settling time of up to 100 ms is necessary until the gain has settled to an optimum level that is well matched to the ambient noise level. using the device in stand-by mode, the TSOP35D25 memorizes its gain setting whil e in standby. on re-activation, the gain immediately returns to the correc t level present before stand-by. this operation insures that there are no spurious pulses on power-up due to mismatch be tween the gain level and the ambient light conditions. low power microcontroller ir receiver (memorizing the gain level during standby) input rc data output ir rec. sby other input and output lines tsop3... battery supply v s = 2.5 v to 5.5 v r s 3 m 22023 output signal of the microcontroller to control the standby mode of the ir receiver the transmitted ir synchronizing pattern the standby is deactivated in advance of the expected data frame output signal of the TSOP35D25 standby off standby on valid sync. pattern synchronizing pattern, sent by the tv data is valid only 2 ms after the standby off signal 22024 datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 7 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors typical characteristics (t amb = 25 c, unless otherwise specified) fig. 1 - delay time after standby-off until the tsop3 is ready to receive data electrical and optical characteristics (1) (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit serial resistor to activate the standby mode v s = 3 v r s 1.2 1.5 2 m v s = 5 v r s 234 standby supply current v s = 3 v, rs = 1.5 m i sby 11.42 a v s = 5 v, rs = 3 m i sby 11.42 latency time for standby-off (delay until there is a valid respose) v s > 2.5 v, dark ambient, output is valid t delay 0.4 0.8 ms v s > 2.5 v, 10 klux dayligth, output is valid t delay 1.5 2.5 duration of standby-off period v s > 2.5 v, dark ambient t sby_off 1 ms v s > 2.5 v, 10 klux daylight, agc1 or agc3 device t sby_off 4 v s > 2.5 v, 10 klux daylight, agc2 or agc4 device t sby_off 3 22025 0 0.5 1 1.5 2 2.5 0.1 1 10 100 ambient daylight brightness (klux) latency time (ms) latency time after standby-off until there is a valid output signal datasheet.in
www.vishay.com document number: 83298 8 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals package dimensions in millimeters assembly instructions reflow soldering ? reflow soldering must be done within 72 h while stored under a max. temperature of 30 c, 60 % rh after opening the dry pack envelope ? set the furnace temperatures for pre-heating and heating in accordance with the re flow temperature profile as shown in the diagram. excercise extreme care to keep the maximum temperature below 260 c. the temperature shown in the profile means the temperature at the device surface. since there is a temperature difference between the component and the circuit bo ard, it should be verified that the temperature of the device is accurately being measured ? handling after reflow should be done only after the work surface has been cooled off manual soldering ? use a soldering iron of 25 w or less. adjust the temperature of the sold ering iron below 300 c ? finish soldering within 3 s ? handle products only after th e temperature has cooled off 2.35 r 1.7 5.51 0.5 0.15 3 x 1.27 = 3.81 2.6 7.5 7.2 4x 1.27 5.3 2.9 4 2.2 pick and place area. tr taping 2.2 3 x 1.27 = 3.81 1.27 0.9 2.8 specifications according to din technical drawings not indicated tolerances 0.3 pick and place area. tt taping footprint (1.5) (1.4) issue: 8; 02.09.09 16776 drawing-no.: 6.544-5341.01-4 a a 0.1 0.1 0.3 0.4 14 datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 9 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors vishay lead (pb)-free reflow solder profile taping version tsop..tt dimensions in millimeters 0 50 100 150 200 250 300 0 50 100 150 200 250 300 t (s) t (c) 255 c 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 20 s max. ramp up 3 c/s max. ramp down 6 c/s max. 2 cycles allowed 19800 16584 datasheet.in
www.vishay.com document number: 83298 10 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals taping version tsop..tr dimensions in millimeters 16585 datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 11 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors reel dimensions in millimeters leader and trailer dimensions in millimeters cover tape peel strength according to din en 60286-3 0.1 n to 1.3 n 300 mm/min. 10 mm/min. 165 to 180 peel angle label standard bar code labels for finished goods the standard bar code labels are product labels and used for identification of goods. th e finished goods are packed in final packing area. the standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses. the labels are on each packing unit and contain vishay semicond uctor gmbh specific data. 16734 trailer leader no devices min. 200 min. 400 start end devices 96 11818 no devices datasheet.in
www.vishay.com document number: 83298 12 rev. 1.0, 25-feb-10 TSOP35D25 vishay semiconductors ir receiver modules for 3d synchronization signals dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed into a cardboard box. a secondary cardboard box is used for shipping purposes. recommended method of storage dry box storage is recommended as soon as the aluminum bag has been opened to preve nt moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 72 h under these conditions moisture content will be too high for reflow soldering. in case of moisture absorptio n, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c/- 0 c and < 5 % rh (dry air/nitrogen) or 96 h at 60 c + 5 c and < 5 % rh for all device containers or 24 h at 125 c + 5 c not suitable for reel or tubes. an eia jedec standard jesd22-a112 level 4 label is included on all dry bags. example of jesd22- a112 level 4 label vishay semiconductor gmbh standard bar code product label (finished goods) plain writting abbreviation length item-description - 18 item-number ino 8 selection-code sel 3 lot-/serial-number batch 10 data-code cod 3 (yww) plant-code ptc 2 quantity qty 8 accepted by acc - packed by pck - mixed code indica tor mixed code - origin xxxxxxx+ company logo long bar code top type length item-number n 8 plant-code n 2 sequence-number x 3 quantity n 8 total length - 21 short bar code bottom type length selection-code x 3 data-code n 3 batch-number x 10 filter - 1 total length - 17 aluminum bag label reel 15973 16943 datasheet.in
document number: 83 298 www.vishay.com rev. 1.0, 25-feb-10 13 TSOP35D25 ir receiver modules for 3d synchronization signals vishay semiconductors esd precaution proper storage and handling procedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electro-static sensitive devices warning labels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors st andard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. 16962 datasheet.in
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners. datasheet.in

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